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Item ID: 255414

1 Offered at Best Price BESI Datacon 2200 evo plus Automatic Die Bonder BESI Datacon 2200 evo plus Automatic Die Bonder Newer Used in Prodcution Die Attach, Flip Chip & Multi-Chip Capability Upgraded Camera Upgraded Image Processing Unit Large Format Heated Stage  Thermal Compensation Open Platform Architecture   ... other images

Location: Plano, Texas, United States

Unit Price	Unstated
Number of Units	1
Manufacturer	BESI
Model	Datacon 2200 evo plus
Description	Automatic Die Bonder
Condition	Like New
Year of Manufacture	2022
CE Marked	YES
Weight	3,307  lb  (1,500 kg)

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